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Journal description
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Details for article 2 of 75 found articles
| Title: |
Application of Ultrasonic Power in Forming Sn58Bi/Cu Solder Joints with Trace Si3N4 Nanowire Doping |
| Author: |
Chen, Chen Zhang, Liang Chen, Mo Huang, Xi Wu, Chuan-jiang |
| Appeared in: |
Journal of materials engineering and performance |
| Paging: | Volume 34 () nr. 6 pages 5263-5272 |
| Year: |
2024-05-03 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 75 found articles
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