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Details for article 7 of 47 found articles
| Title: |
Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature |
| Author: |
Zhao, Xiangxi Zhang, Wei Liu, Wei Hang, Chunjin Tian, Yanhong |
| Appeared in: |
Journal of materials engineering and performance |
| Paging: | Volume 33 () nr. 16 pages 8236-8241 |
| Year: |
2023-07-31 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 7 of 47 found articles
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