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Journal description
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Details for article 35 of 47 found articles
| Title: |
Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films |
| Author: |
Lai, Yu-Chang Yang, Zi-Hong Chen, Yin-Hsuan Chen, Yen-Ting Lin, Ang-Ying Chuang, Tung-Han |
| Appeared in: |
Journal of materials engineering and performance |
| Paging: | Volume 33 () nr. 16 pages 8044-8056 |
| Year: |
2023-08-14 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 35 of 47 found articles
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