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                                       Details for article 37 of 39 found articles
 
 
  The Influence of Plasma Treatment and Substrate Bias Voltage on the Bonding Properties of Carbon Fiber/Copper Composites
 
 
Title: The Influence of Plasma Treatment and Substrate Bias Voltage on the Bonding Properties of Carbon Fiber/Copper Composites
Author: Wang, Ruijun
Liu, Jingbo
Wang, Tianshi
Pang, Xiaolu
Xu, Lining
Qiao, Lijie
Appeared in: Journal of materials engineering and performance
Paging: Volume 32 () nr. 23 pages 10924-10933
Year: 2023-02-08
Contents:
Publisher: Springer US, New York
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 37 of 39 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands