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                                       Details for article 9 of 39 found articles
 
 
  Effect of Al2O3 Nanoparticle Addition on the Microstructure, Mechanical, Thermal, and Electrical Properties of Melt-Spun SAC355 Lead-Free Solder for Electronic Packaging
 
 
Title: Effect of Al2O3 Nanoparticle Addition on the Microstructure, Mechanical, Thermal, and Electrical Properties of Melt-Spun SAC355 Lead-Free Solder for Electronic Packaging
Author: Al-sorory, Hamed
Gumaan, Mohammed S.
Shalaby, Rizk Mostafa
Appeared in: Journal of materials engineering and performance
Paging: Volume 32 () nr. 19 pages 8600-8611
Year: 2022-12-27
Contents:
Publisher: Springer US, New York
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 9 of 39 found articles
 
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