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Journal description
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Details for article 39 of 70 found articles
| Title: |
Low-Resistance Room-Temperature Interconnection Technique for Bonding Fine Pitch Bumps |
| Author: |
Roustaie, F. Quednau, S. Weißenborn, F. Birlem, O. |
| Appeared in: |
Journal of materials engineering and performance |
| Paging: | Volume 30 () nr. 5 pages 3173-3177 |
| Year: |
2021-03-22 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 39 of 70 found articles
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