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Journal description
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Details for article 19 of 68 found articles
| Title: |
Effect of Ni Content on the Microstructure Formation and Properties of Sn-0.7Cu-xNi Solder Alloys |
| Author: |
Fan, Jianglei Zhai, Hengtao Liu, Zhanyun Wang, Xiao Li, Ying Gao, Hongxia Liu, Jianxiu |
| Appeared in: |
Journal of materials engineering and performance |
| Paging: | Volume 29 () nr. 8 pages 4934-4943 |
| Year: |
2020-08-03 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 68 found articles
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