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Journal description
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Details for article 27 of 53 found articles
| Title: |
Influence of Cu Nanoparticles on Microstructure and Mechanical Properties of Sn0.7Ag0.5Cu-BiNi/Cu Solder Joint |
| Author: |
Ban, G. F. Sun, F. L. Fan, J. J. Liu, Y. Cong, S. N. |
| Appeared in: |
Journal of materials engineering and performance |
| Paging: | Volume 26 (2017) nr. 3 pages 1069-1075 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 27 of 53 found articles
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