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Journal description
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Details for article 38 of 41 found articles
| Title: |
Thermal Properties, Electrochemical Behavior, and Microstructure of Zn-5Sn-2Cu-1.5Bi-xRE High-Temperature Solder |
| Author: |
Xing, Fei Qiu, Xiaoming |
| Appeared in: |
Journal of materials engineering and performance |
| Paging: | Volume 24 (2015) nr. 4 pages 1679-1686 |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 38 of 41 found articles
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