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Journal description
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Details for article 26 of 37 found articles
| Title: |
Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications |
| Author: |
Mallik, Sabuj Chan, Erica Hiu Laam Ekere, Ndy |
| Appeared in: |
Journal of materials engineering and performance |
| Paging: | Volume 22 (2012) nr. 4 pages 1186-1193 |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 26 of 37 found articles
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