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                                       Details for article 14 of 36 found articles
 
 
  Effect of Purging Gas on Wetting Behavior of Sn-3.5Ag Lead-Free Solder on Nickel-Coated Aluminum Substrate
 
 
Title: Effect of Purging Gas on Wetting Behavior of Sn-3.5Ag Lead-Free Solder on Nickel-Coated Aluminum Substrate
Author: Prabhu, K. N.
Varun, M.
Satyanarayan,
Appeared in: Journal of materials engineering and performance
Paging: Volume 22 (2012) nr. 3 pages 723-728
Year: 2012
Contents:
Publisher: Springer US, Boston
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 14 of 36 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands