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Journal description
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Details for article 9 of 20 found articles
| Title: |
Growth Behavior of Intermetallic Compounds at SnAgCu/Ni and Cu Interfaces |
| Author: |
Qi, Lihua Huang, Jihua Zhang, Hua Zhao, Xingke Wang, Haitao Cheng, Donghai |
| Appeared in: |
Journal of materials engineering and performance |
| Paging: | Volume 19 (2009) nr. 1 pages 129-134 |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 9 of 20 found articles
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