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Journal description
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Details for article 5 of 14 found articles
| Title: |
Interfacial Reactions and Bonding Strength of Sn-xAg-0.5Cu/Ni BGA Solder Joints |
| Author: |
Lin, K.S. Huang, H.Y. Chou, C.P. |
| Appeared in: |
Journal of materials engineering and performance |
| Paging: | Volume 18 (2008) nr. 2 pages 182-189 |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 14 found articles
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