Au-Sn SLID Bonding: A Reliable HT Interconnect and Die Attach Technology
Titel:
Au-Sn SLID Bonding: A Reliable HT Interconnect and Die Attach Technology
Auteur:
Tollefsen, Torleif André Larsson, Andreas Taklo, Maaike Margrete Visser Neels, Antonia Maeder, Xavier Høydalsvik, Kristin Breiby, Dag W. Aasmundtveit, Knut
Verschenen in:
Metallurgical and materials transactions. B, Process metallurgy and materials processing science