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  A Coupled Thermal-Mechanical Analysis of Ultrasonic Bonding Mechanism
 
 
Title: A Coupled Thermal-Mechanical Analysis of Ultrasonic Bonding Mechanism
Author: Zhang, Chunbo (SAM)
Li, Leijun
Appeared in: Metallurgical and materials transactions. B, Process metallurgy and materials processing science
Paging: Volume 40 (2009) nr. 2 pages 196-207
Year: 2009
Contents:
Publisher: Springer US, Boston
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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