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Journal description
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Details for article 29 of 45 found articles
| Title: |
Prefabrication and Characterization of Copper–Silver Foam Composites for Low-Temperature Interconnection of Power Modules |
| Author: |
Fan, Yinxiang Yan, Haidong Li, Junye Lv, Guoping Liu, Yuncan Zhang, Yakun Liu, Chaohui |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 53 () nr. 3 pages 1360-1373 |
| Year: |
2023-12-10 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 29 of 45 found articles
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