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Journal description
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Details for article 21 of 65 found articles
| Title: |
Evolution of Microstructure and Mechanical Properties of Copper Pillar Solder Joints Under Ultrasound |
| Author: |
Li, Kui Wu, Daowei Lu, Peiyuan Li, Zhankun Li, Junhui |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 52 () nr. 1 pages 327-341 |
| Year: |
2022-10-12 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 65 found articles
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