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Details for article 23 of 45 found articles
| Title: |
In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint |
| Author: |
Cornet, L. Yedra, L. Héripré, É. Aubin, V. Schmitt, J.-H. Giorgi, M.-L. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 51 () nr. 4 pages 1568-1582 |
| Year: |
2022-01-18 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 23 of 45 found articles
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