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Details for article 24 of 85 found articles
| Title: |
Effects of Ni Nanoparticles on the Growth Rate of Intermetallic Compounds (IMCs) Between Sn-3.0Ag-0.5Cu (SAC305) Solder and Cu-2.0Be Substrate |
| Author: |
Yin, Zuozhu Lin, Mei Li, Qi Lv, Xiaochun |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 49 () nr. 11 pages 6721-6726 |
| Year: |
2020-09-14 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 24 of 85 found articles
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