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Journal description
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Details for article 22 of 60 found articles
| Title: |
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure |
| Author: |
Gao, Li-Yin Cui, Xian-Wei Tian, Fei-Fei Liu, Zhi-Quan |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 49 () nr. 10 pages 6223-6231 |
| Year: |
2020-08-13 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 22 of 60 found articles
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