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Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys |
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Title: |
Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys |
Author: |
Delhaise, André M. Snugovsky, Polina Kennedy, Jeff Hillman, David Matijevic, Ivan Meschter, Stephan Adams, David Kammer, Milea Romansky, Marianne Juarez, Joseph Straznicky, Ivan Snugovsky, Leonid Wilcoxon, Ross Perovic, Doug D. |
Appeared in: |
Journal of electronic materials |
Paging: |
Volume 49 () nr. 1 pages 116-127 |
Year: |
2019 |
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Publisher: |
Springer US, New York |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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