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Journal description
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Details for article 37 of 65 found articles
| Title: |
Low-Temperature Cu-Cu Bonding Process Based on the Sn-Cu Multilayer and Self-Propagating Reaction Joining |
| Author: |
Fan, Jinhu Shi, Tielin Tang, Zirong Gong, Bo Li, Junjie Huang, Jie Li, Tianxiang |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 48 (2018) nr. 2 pages 1310-1317 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 37 of 65 found articles
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