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                                       Details for article 30 of 65 found articles
 
 
  Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment
 
 
Title: Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment
Author: Chen, Chuantong
Zhang, Zheng
Choe, Chanyang
Kim, Dongjin
Noh, Seungjun
Sugahara, Toru
Suganuma, Katsuaki
Appeared in: Journal of electronic materials
Paging: Volume 48 (2018) nr. 2 pages 1106-1115
Year: 2018
Contents:
Publisher: Springer US, New York
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 30 of 65 found articles
 
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