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Journal description
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Details for article 29 of 80 found articles
| Title: |
Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder |
| Author: |
Gu, Tianhong Gourlay, Christopher M. Britton, T. Ben |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 48 (2018) nr. 1 pages 107-121 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 29 of 80 found articles
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