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Journal description
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Details for article 3 of 66 found articles
| Title: |
A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints |
| Author: |
Borgesen, Peter Wentlent, Luke Hamasha, Sa’d Khasawneh, Saif Shirazi, Sam Schmitz, Debora Alghoul, Thaer Greene, Chris Yin, Liang |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 47 (2018) nr. 5 pages 2526-2544 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 66 found articles
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