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Journal description
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Details for article 80 of 90 found articles
| Title: |
Thermal Stress Assessment for Transient Liquid-Phase Bonded Si Chips in High-Power Modules Using Experimental and Numerical Methods |
| Author: |
Lis, Adrian Kicin, Slavo Brem, Franziska Leinenbach, Christian |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 46 (2016) nr. 2 pages 729-741 |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 80 of 90 found articles
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