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Details for article 25 of 61 found articles
| Title: |
Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints |
| Author: |
Liu, Shengfa Hu, Zhebing Xiong, Jieran Tan, Guanghua Xiong, Wenyong Chen, Chen Huang, Shangyu |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 46 (2017) nr. 11 pages 6373-6380 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 25 of 61 found articles
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