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Journal description
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Details for article 43 of 90 found articles
| Title: |
Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance |
| Author: |
Lee, Tae-Kyu Chen, Zhiqiang Guirguis, Cherif Akinade, Kola |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 46 (2017) nr. 10 pages 6224-6233 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 43 of 90 found articles
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