|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 51 of 70 found articles
| Title: |
Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution |
| Author: |
Choudhury, Soud Farhan Ladani, Leila |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 45 (2016) nr. 7 pages 3683-3694 |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 51 of 70 found articles
| << previous | next >> |