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Journal description
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Details for article 17 of 102 found articles
| Title: |
Effect of Joint Scale and Processing on the Fractureof Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumpsin 3D Packages |
| Author: |
Talebanpour, B. Huang, Z. Chen, Z. Dutta, I. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 45 (2015) nr. 1 pages 57-68 |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 102 found articles
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