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Journal description
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Details for article 7 of 86 found articles
| Title: |
Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of Joints |
| Author: |
Kim, Yang Ho Ma, Sung Woo Kim, Young-Ho |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 43 (2014) nr. 9 pages 3296-3306 |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 7 of 86 found articles
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