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Journal description
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Details for article 40 of 44 found articles
| Title: |
The Effects of Si Submounts Containing Cu Thermal Viason the Heat-Dissipation Characteristics of a High-PowerLight-Emitting Diode Package |
| Author: |
Kim, M. Y. Jeong, T. Ha, J. S. Oh, T. S. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 43 (2013) nr. 2 pages 630-635 |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 40 of 44 found articles
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