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                                       Details for article 37 of 37 found articles
 
 
  The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration
 
 
Title: The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration
Author: Linares, Xioranny
Kinney, Chris
Lee, Kyu-Oh
Morris, J. W.
Appeared in: Journal of electronic materials
Paging: Volume 43 (2013) nr. 1 pages 43-51
Year: 2013
Contents:
Publisher: Springer US, Boston
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 37 of 37 found articles
 
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