|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 9 of 24 found articles
| Title: |
Impact of Electrical Current on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects |
| Author: |
Lee, Tae-Kyu |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 42 (2012) nr. 4 pages 599-606 |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 9 of 24 found articles
| << previous | next >> |