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  Abnormal Diffusion Behavior of Zn in Cu/Sn-9 wt.%Zn/Cu Interconnects During Liquid–Solid Electromigration
 
 
Title: Abnormal Diffusion Behavior of Zn in Cu/Sn-9 wt.%Zn/Cu Interconnects During Liquid–Solid Electromigration
Author: Huang, M. L.
Zhou, Q.
Zhao, N.
Zhang, Z. J.
Appeared in: Journal of electronic materials
Paging: Volume 42 (2013) nr. 10 pages 2975-2982
Year: 2013
Contents:
Publisher: Springer US, Boston
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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