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Journal description
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Details for article 6 of 26 found articles
| Title: |
Experimental Evaluation of the Effect of Pad Debris Size on Microscratches during CMP Process |
| Author: |
Yang, Ji Chul Kim, Hojoong Oh, Dong Won Won, Jai-Hyung Lee, Chil-Gee Kim, Taesung |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 42 (2012) nr. 1 pages 97-102 |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 26 found articles
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