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Details for article 10 of 45 found articles
| Title: |
Effect of Prebonding Anneal on the Microstructure Evolution and Cu–Cu Diffusion Bonding Quality for Three-Dimensional Integration |
| Author: |
Peng, L. Lim, D.F. Zhang, L. Li, H.Y. Tan, C.S. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 41 (2012) nr. 9 pages 2567-2572 |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 45 found articles
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