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Journal description
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Details for article 9 of 14 found articles
| Title: |
Low-Temperature III–V Direct Wafer Bonding Surface Preparation Using a UV-Sulfur Process |
| Author: |
Jackson, Michael J. Chen, Li-Min Kumar, Ankit Yang, Yang Goorsky, Mark S. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 40 (2010) nr. 1 pages 1-5 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 9 of 14 found articles
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