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Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders |
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Title: |
Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders |
Author: |
Ogura, Hiroshi Maruyama, Minoru Matsubayashi, Ryo Ogawa, Tetsuya Nakamura, Shigeyoshi Komatsu, Teruo Nagasawa, Hiroshi Ichimura, Akio Isoda, Seiji |
Appeared in: |
Journal of electronic materials |
Paging: |
Volume 39 (2010) nr. 8 pages 1233-1240 |
Year: |
2010 |
Contents: |
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Publisher: |
Springer US, Boston |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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