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Journal description
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Details for article 1 of 14 found articles
| Title: |
Additive Occupancy in the Cu6Sn5-Based Intermetallic Compound Between Sn-3.5Ag Solder and Cu Studied Using a First-Principles Approach |
| Author: |
Gao, Feng Qu, Jianmin Takemoto, Tadashi |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 39 (2010) nr. 4 pages 426-432 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 14 found articles
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