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Details for article 2 of 30 found articles
| Title: |
Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface |
| Author: |
Zhou, Bite Bieler, Thomas R. Lee, Tae-kyu Liu, Kuo-Chuan |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 39 (2010) nr. 12 pages 2669-2679 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 30 found articles
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