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Journal description
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Details for article 16 of 22 found articles
| Title: |
Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints |
| Author: |
Chang, Y. W. Chiu, S. H. Chen, Chih |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 39 (2010) nr. 11 pages 2489-2494 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 16 of 22 found articles
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