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Journal description
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Details for article 14 of 22 found articles
| Title: |
Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps |
| Author: |
Jeong, Myeong-Hyeok Lim, Gi-Tae Kim, Byoung-Joon Lee, Ki-Wook Kim, Jae-Dong Joo, Young-Chang Park, Young-Bae |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 39 (2010) nr. 11 pages 2368-2374 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 22 found articles
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