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Details for article 12 of 22 found articles
| Title: |
Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish |
| Author: |
Wu, W. H. Lin, C. S. Huang, S. H. Ho, C. E. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 39 (2010) nr. 11 pages 2387-2396 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 22 found articles
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