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                                       Details for article 10 of 21 found articles
 
 
  Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization
 
 
Title: Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization
Author: Xu, Hui
Liu, Changqing
Silberschmidt, Vadim V.
Chen, Zhong
Appeared in: Journal of electronic materials
Paging: Volume 39 (2009) nr. 1 pages 124-131
Year: 2009
Contents:
Publisher: Springer US, Boston
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 10 of 21 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands