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                                       Details for article 24 of 26 found articles
 
 
  Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints
 
 
Title: Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints
Author: Lai, R. S.
Lin, K. L.
Salam, B.
Appeared in: Journal of electronic materials
Paging: Volume 38 (2008) nr. 1 pages 88-92
Year: 2008
Contents:
Publisher: Springer US, Boston
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 24 of 26 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands