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Journal description
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Details for article 24 of 26 found articles
| Title: |
Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints |
| Author: |
Lai, R. S. Lin, K. L. Salam, B. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 38 (2008) nr. 1 pages 88-92 |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 24 of 26 found articles
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