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Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate |
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Titel: |
Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate |
Auteur: |
Takaku, Yoshikazu Makino, Komei Watanabe, Keita Ohnuma, Ikuo Kainuma, Ryosuke Yamada, Yasushi Yagi, Yuji Nakagawa, Ikuo Atsumi, Takashi Ishida, Kiyohito |
Verschenen in: |
Journal of electronic materials |
Paginering: |
Jaargang 38 (2008) nr. 1 pagina's 54-60 |
Jaar: |
2008 |
Inhoud: |
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Uitgever: |
Springer US, Boston |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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