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Details for article 1 of 18 found articles
| Title: |
A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates |
| Author: |
Son, Ho-Young Jung, Gi-Jo Park, Byung-Jin Paik, Kyung-Wook |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 37 (2008) nr. 12 pages 1832-1842 |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 18 found articles
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