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Journal description
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Details for article 15 of 18 found articles
| Title: |
Reliability of Conductive Adhesives as a Pb-free Alternative in Flip-Chip Applications |
| Author: |
Kim, Jong-Woong Lee, Young-Chul Jung, Seung-Boo |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 37 (2007) nr. 1 pages 9-16 |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 18 found articles
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