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Journal description
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Details for article 10 of 18 found articles
| Title: |
Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders |
| Author: |
Yen, Yee-Wen Chou, Weng-Ting Tseng, Yu Lee, Chiapyng Hsu, Chun-Lei |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 37 (2007) nr. 1 pages 73-83 |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 18 found articles
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